D2D-based proximity service is a very hot topic with great commercial potential from an applicati...

The multi-billion-dollar microsystem packaging business continues to play an increasingly importa...

The multi-billion-dollar microsystem packaging business continues to play an increasingly importa...

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the de...

D2D-based proximity service is a very hot topic with great commercial potential from an applicati...

This book focuses on the topology theory of mechanisms developed by the authors and provides a sy...

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introdu...

This book focuses on the topology theory of mechanisms developed by the authors and provides a...

This book focuses on the topology theory of mechanisms developed by the authors and provides a...