Conference Proceedings of 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering

This book will be a collection of the conference manuscripts presented at the 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering covering new and renewable energy, electrical and power engineering. It is expected to report the latest technological developments in the fields developed by academic researchers and industrial practitioners. The application and dissemination of these technologies will benefit the research community, as new research directions are becoming increasingly interdisciplinary, requiring researchers from different research areas to come together and share ideas. It will also benefit the electrical engineering and energy industry, as we are now experiencing a new wave of industrial revolution, i.e. the electrification, intelligentisation and digitalisation of our transport, manufacturing processes and way of thinking.

This book will be a collection of the conference manuscripts presented at the 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering covering new and renewable energy, electrical and power engineering. It is expected to report the latest technological developments in the fields developed by academic researchers and industrial practitioners. The application and dissemination of these technologies will benefit the research community, as new research directions are becoming increasingly interdisciplinary, requiring researchers from different research areas to come together and share ideas. It will also benefit the electrical engineering and energy industry, as we are now experiencing a new wave of industrial revolution, i.e. the electrification, intelligentisation and digitalisation of our transport, manufacturing processes and way of thinking.

Study on the Influence of Parasitic Parameters on the Switching Characteristics and High Frequency Oscillation of SiC MOSFET.- A DSRD-based Trigger Circuit for RBDT.- Deformation analysis of press-pack IGBT using thermal mechanical coupling method.