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Encyclopedia of Thermal Packaging: Set 2: Thermal Packaging Tools (a 4-Volume Set)
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Artikel-Nr:
9789814327602
Veröffentl:
2014
Erscheinungsdatum:
01.12.2014
Seiten:
1396
Autor:
Avram Bar-Cohen
Gewicht:
3583 g
Format:
259x180x114 mm
Sprache:
Englisch
Beschreibung:
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, from cell phones to supercomputers, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.
Single Chip Packages; Printed Circuit Board Arrays; Multichip Modules; Racks; Cabinets.