Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)

Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)
-0 %
Besorgungstitel - wird vorgemerkt | Lieferzeit: Besorgungstitel - Lieferbar innerhalb von 10 Werktagen I

Unser bisheriger Preis:ORGPRICE: 1.185,50 €

Jetzt 1.185,38 €*

Alle Preise inkl. MwSt. | Versandkostenfrei
Artikel-Nr:
9789813239661
Veröffentl:
2018
Erscheinungsdatum:
15.12.2018
Seiten:
904
Autor:
Avram Bar-Cohen
Gewicht:
2223 g
Format:
254x173x56 mm
Sprache:
Englisch
Beschreibung:

Thermal and mechanical packaging the enabling technologies for the physical implementation of electronic systems are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and gradua

Kunden Rezensionen

Zu diesem Artikel ist noch keine Rezension vorhanden.
Helfen sie anderen Besuchern und verfassen Sie selbst eine Rezension.