Beschreibung:
Vibration assisted machining is becoming a potential machining process for difficult-to-cut materials in aerospace and biomedical applications. This book presents the fundamentals, modelling and applications of vibration assisted machining process. It provides investigations on cutting forces, temperature, cutting stability, surface topography, microstructure evolution and tool wear in vibration assisted machining. Three representative regimes (i.e., ultrasonically assisted machining, modulation assisted machining and elliptical vibration machining) are investigated in this book. The systematic and in-depth research in this process will provide important theoretical and practical reference for researchers and engineers in relative fields.
Vibration assisted machining is becoming a potential machining process for difficult-to-cut materials in aerospace and biomedical applications. This book presents the fundamentals, modelling and applications of vibration assisted machining process. It provides investigations on cutting forces, temperature, cutting stability, surface topography, microstructure evolution and tool wear in vibration assisted machining. Three representative regimes (i.e., ultrasonically assisted machining, modulation assisted machining and elliptical vibration machining) are investigated in this book. The systematic and in-depth research in this process will provide important theoretical and practical reference for researchers and engineers in relative fields.
Introduction.- Fundamentals and System of Vibration Assisted Machining.- Kinematics of Vibration Assisted Cutting.- Cutting Forces in Vibration Assisted Cutting.- Temperature in Vibration Assisted Cutting.- Cutting Stability in Vibration Assisted Cutting.- Surface Topography and Roughness in Vibration Assisted Machining.- Microstructural Evolution in Vibration Assisted Cutting.- Tool Wear in Vibration Assisted Machining.- Aerospace Applications of Vibration Assisted Machining.- Biomedical Applications of Vibration Assisted Machining.