Handbook of 3D Integration

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Beiträge von Forschern und Strategen an Universitäten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte für zukünftige Entwicklungen.

1 Introduction to 3D Integration2 Drivers for 3D Integration3 Overview of 3D Process TechnologyPart I - Through Silicon Via Fabrication4 Deep Reactive Ion Etching5 Laser Ablation6 Insulation - SiO27 Insulation - Organic Dielectrics8 Copper Plating9 Metallization by chemical vapor deposition of W and CuPart II - Wafer Thinning and Bonding Technology10 Fabrication, Processing and Singulation of Thin Wafers11 Overview of Bonding Technologies for 3D Integration12 Chip-to-Wafer and Wafer-to-Wafer Integration Schemes13 Polymer Adhesive Bonding Technology14 Bonding with Intermetallic CompoundsPart III - Integration Processes15 Commercial Activity16 Fraunhofer IZM17 Interconnect Process at the University of Arkansas18 Vertical Interconnection by ASET at Toshiba19 3D Integration at CEA-LETI20 Lincoln Laboratory's Integration Technology21 3D Integration Technologies at IMEC22 Fabrication Using Copper Thermo-Compression Bonding at MIT23 Rensselaer 3D Integration Processes24 3D Integration at Tezzaron Semiconductor Corporation25 3D Integration at Ziptronix, Inc.26 3D Integration at ZyCube Sendai Lab.Part IV - Design, Performance, and Thermal Management27 Design for 3D Integration at NC State University28 Design for 3D Integration at Fraunhofer IIS-EAS29 Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology30 Computer-aided Design for 3D Circuits at the University of Minnesota31 Electrical Performance of 3D Circuits32 Testing of 3D Circuits33 Thermal Management of Vertically Integrated Packages at IBM ZurichPart V - Applications34 3D and Microprocessors35 3D Memories36 Sensor Arrays37 Power Devices38 Wireless Sensor Systems - The e-CUBES Project39 Conclusions