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Hybrid Systems-in-Foil
Paperback
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Artikel-Nr:
9781108984744
Veröffentl:
2021
Einband:
Paperback
Erscheinungsdatum:
06.10.2021
Seiten:
92
Autor:
Mourad Elsobky
Gewicht:
148 g
Format:
229x152x5 mm
Sprache:
Englisch
Beschreibung:
An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable electronic components are presented demonstrating the benefits of HySiF, and prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
1. Flexible Electronics and Hybrid Systems-in-Foil; 2. Ultra-Thin Chip Fabrication and Flexible Packaging Technologies; 3. On-Foil Passive and Active Components; 4. Ultra-Thin Chip Characterization; 5. Hybrid Systems-in-Foil Demonstrators; Abbreviations; References.