Bücher online kaufen
Advances in Thermal Modeling of Electronic Components and Systems, Volume 2
-0 %
Besorgungstitel - wird vorgemerkt | Lieferzeit: Besorgungstitel - Lieferbar innerhalb von 10 Werktagen I
Artikel-Nr:
9780791800157
Veröffentl:
1990
Erscheinungsdatum:
01.01.1990
Seiten:
437
Autor:
Avram Bar-Cohen
Gewicht:
771 g
Format:
231x155x28 mm
Sprache:
Englisch
Beschreibung:
The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.