Semiconductor Process Reliability in Practice

Semiconductor Process Reliability in Practice
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Artikel-Nr:
9780071754279
Veröffentl:
2012
Erscheinungsdatum:
16.11.2012
Seiten:
624
Autor:
Juin Liou
Gewicht:
1050 g
Format:
234x158x38 mm
Sprache:
Englisch
Beschreibung:

Zhenghao Gan is a reliability technical manager at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive technical and management experience in research and development of semiconductor reliability improvement, testing/characterization, problem solving, project management, modeling, and analysis.
Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

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