Bücher online kaufen
System on Package
-0 %
Miniaturization of the Entire System
Besorgungstitel - wird vorgemerkt | Lieferzeit: Besorgungstitel - Lieferbar innerhalb von 10 Werktagen I
Artikel-Nr:
9780071459068
Veröffentl:
2007
Erscheinungsdatum:
01.04.2007
Seiten:
785
Autor:
Rao Tummala
Gewicht:
1397 g
Format:
236x193x36 mm
Sprache:
Englisch
Beschreibung:
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Chapter 1. Introduction to the System-on-Package (SOP) TechnologyChapter 2. Introduction to System-on-Chip (SOC)Chapter 3. Stacked ICs and Packages (SIP)Chapter 4. Mixed-Signal (SOP) DesignChapter 5. Radio Frequency System-on-Package (RF SOP)Chapter 6. Integrated Chip-to-Chip Optoelectronic SOPChapter 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded ComponentsChapter 8. Mixed-Signal ReliabilityChapter 9. MEMS PackagingChapter 10. Wafer-Level SOPChapter 11. Thermal SOPChapter 12. Electrical Test of SOP Modules and SystemsChapter 13. Biosensor SOPIndex